NEWS

We're proud to announce that we have added one of the worlds most prestigious universities to our customer list. Equipment installation will take place in Q2 2019. and we are very excited about this collaboration and are already looking forward to future...

As part of FOM Technologies participation in the Horizon 2020 - Harvest project, we are attending the NextFlex conference about Flexible Hybrid Electronics for Aerospace in Seattle hosted by Boeing. Here - our US partner, Uni. of Washington is presenting their...

FOM Technologies will exhibit at the prestigious innoLAE conference taken place at the Welcome Genome Campus at Cambridge (UK) from the 22nd of jan. - 23rd of jan. 2019. Large-area electronics include printable, flexible or organic electronics, and is a new way of...

FOM Technologies joins GreEN (Green Electronics Network). Sheer numbers of printed sensors for the IoT will present an environmental challenge, making printed electronics and end-of-life disposal of devices environmentally friendly and green to alleviate the huge...